Agile RF, Inc.
Agile Materials & Technologies, Inc. and Paratek Microwave, Inc. settle patent litigation
Santa Barbara, California and Columbia, Maryland - February 2, 2006 - Agile Materials & Technologies, Inc. (“Agile”) and Paratek Microwave, Inc. (“Paratek”), today announced that they have reached a settlement agreement on all litigation between the two parties. Pursuant to the agreement, the parties are dismissing their claims against each other with prejudice. The terms of the settlement are confidential.
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